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MOTOROLA
Freescale Semiconductor, Inc.
SEMICONDUCTOR TECHNICAL DATA
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Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The MPXV4006G series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. Features
MPXV4006G SERIES
INTEGRATED PRESSURE SENSOR 0 to 6 kPa (0 to 0.87 psi) 0.2 to 4.7 V OUTPUT
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* Temperature Compensated over 10 to 60C * Ideally Suited for Microprocessor or Microcontroller- Based Systems * Available in Gauge Surface Mount (SMT) or Through- hole (DIP) Configurations * Durable Thermoplastic (PPS) Package
SMALL OUTLINE PACKAGE SURFACE MOUNT
SMALL OUTLINE PACKAGE THROUGH-HOLE J
VS
MPXV4006G6U CASE 482
MPXV4006G7U CASE 482B
SENSING ELEMENT
THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1
GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY
Vout
MPXV4006GC6U CASE 482A MPXV4006GC7U CASE 482C
PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXV4006GP CASE 1369
PIN NUMBER
1 2 3 4 N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. MPXV4006DP CASE 1351
Replaces MPXT4006D/D
REV 4
Motorola Sensor Device Data (c) Motorola, Inc. 2002
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MPXV4006G SERIES
MAXIMUM RATINGS(NOTE)
Parametrics Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature
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Symbol Pmax Tstg TA Value 24 -30 to +100 +10 to +60 Unit kPa C C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3
required to meet electrical specifications.) Characteristic Pressure Range Supply Voltage(1) Supply Current Symbol POP VS IS (RL = 51k) (RL = 51k) VFSS Voff V/P (10 to 60C) -- Min 0 4.75 -- -- 0.100 -- -- Typ -- 5.0 -- 4.6 0.225 766 -- Max 6.0 5.25 10 -- 0.430 -- 5.0 Unit kPa Vdc mAdc V V mV/kPa %VFSS
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Full Scale Offset(3)(5) Sensitivity
Span(2)
Accuracy(4)(5)
NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * Offset Stability: Output deviation, after 1000 temperature cycles, *30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be "autozeroed'' after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations.
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The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4006G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification
MPXV4006G SERIES
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.
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FLUOROSILICONE GEL DIE COAT P1 WIRE BOND
DIE
STAINLESS STEEL CAP
+5 V
Vout Vs IPS OUTPUT
THERMOPLASTIC CASE
LEAD FRAME
1.0 mF
0.01 mF
GND
470 pF
P2 DIFFERENTIAL SENSING ELEMENT DIE BOND
Figure 2. Cross-Sectional Diagram (Not to Scale)
Figure 3. Recommended power supply decoupling and output filtering recommendations. For additional output filtering, please refer to Application Note AN1646.
5.0
OUTPUT (V)
TRANSFER FUNCTION: 4.5 Vout = VS*[(0.1533*P) + 0.045] 5% VFSS 4.0 VS = 5.0 V 0.25 Vdc TEMP = 10 to 60C 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 3 DIFFERENTIAL PRESSURE (kPa) 6 MAX MIN TYPICAL
Figure 4. Output versus Pressure Differential
(See Note 5 in Operating Characteristics)
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MPXV4006G SERIES
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sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below:
Pressure (P1) Side Identifier Stainless Steel Cap Side with Port Attached Stainless Steel Cap Side with Port Attached Side with Port Attached Side with Part Marking
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola presPart Number MPXV4006G6U/T1 MPXV4006GC6U/T1 MPXV4006G7U MPXV4006GC7U MPXV4006GP MPXV4006DP Case Type 482 482A 482B 482C 1369 1351
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ORDERING INFORMATION MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options are offered for the 482 and 482A case configurations.
Device Type Basic Element Options Element Only Element Only Element Only Ported Element Axial Port Axial Port Axial Port Side Port Dual Port Case No. 482 482 482 482A 482A 482A 1369 1351 MPX Series Order No. MPXV4006G6U MPXV4006G6T1 MPXV4006G7U MPXV4006GC6U MPXV4006GC6T1 MPXV4006GC7U MPXV4006GP MPXV4006DP Packing Options Rails Tape and Reel Rails Rails Tape and Reel Rails Trays Trays Marking MPXV4006G MPXV4006G MPXV4006G MPXV4006G MPXV4006G MPXV4006G MPXV4006G MPXV4006G
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.
0.100 TYP 8X 2.54
0.660 16.76
0.060 TYP 8X 1.52
0.300 7.62
0.100 TYP 8X 2.54
inch mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
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SMALL OUTLINE PACKAGE DIMENSIONS SURFACE MOUNT
MPXV4006G SERIES
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
-B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41
S
N
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J K M
C
H -T-
PIN 1 IDENTIFIER SEATING PLANE
CASE 482-01 ISSUE O
-A-
5 4
D 8 PL 0.25 (0.010)
M
TB
S
A
S
N -B-
8
G
1
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17
S
W
V C H J K M
PIN 1 IDENTIFIER
-T-
SEATING PLANE
CASE 482A-01 ISSUE A
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MPXV4006G SERIES
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SMALL OUTLINE PACKAGE DIMENSIONS - CONTINUED SURFACE MOUNT
2 PLACES 4 TIPS
0.008 (0.20) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
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B
E1
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.300 0.330 0.002 0.010 0.038 0.042 0.465 0.485 0.717 BSC 0.465 0.485 0.100 BSC 0.245 0.255 0.120 0.130 0.061 0.071 0.270 0.290 0.080 0.090 0.009 0.011 0.115 0.125 0 7 MILLIMETERS MIN MAX 7.11 7.62 0.05 0.25 0.96 1.07 11.81 12.32 18.21 BSC 11.81 12.32 2.54 BSC 6.22 6.47 3.05 3.30 1.55 1.80 6.86 7.36 2.03 2.28 0.23 0.28 2.92 3.17 0 7
T
N K
A
8X
M
P
0.004 (0.1)
SEATING PLANE
DETAIL G C
CASE 1369-01 ISSUE O
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SMALL OUTLINE PACKAGE DIMENSIONS - CONTINUED SURFACE MOUNT
2 PLACES 4 TIPS
MPXV4006G SERIES
0.006 (0.15) C A B A E e
5 4 GAGE PLANE
e/2 .014 (0.35) L DETAIL G A1
D
8
1 8X
F
b 0.004 (0.1)
M
CAB
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B
E1
STYLE 1: PIN 1. 2. 3. 4. 5. 6. 7. 8.
GND +Vout Vs -Vout N/C N/C N/C N/C
STYLE 2: PIN 1. 2. 3. 4. 5. 6. 7. 8.
N/C Vs GND Vout N/C N/C N/C N/C
NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994. 3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION "b" DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A A1 b D E E1 e F K L M N P T INCHES MIN MAX 0.370 0.390 0.002 0.010 0.038 0.042 0.465 0.485 0.680 0.700 0.465 0.485 0.100 BSC 0.240 0.260 0.115 0.135 0.040 0.060 0.270 0.290 0.160 0.180 0.009 0.011 0.110 0.130 0 7 MILLIMETERS MIN MAX 9.39 9.91 0.05 0.25 0.96 1.07 11.81 12.32 17.27 17.78 11.81 12.32 2.54 BSC 6.10 6.60 2.92 3.43 1.02 1.52 6.86 7.37 4.06 4.57 0.23 0.28 2.79 3.30 0 7
N
T
A
M
P
8X
0.004 (0.1)
SEATING PLANE
DETAIL G C
K
CASE 1351-01 ISSUE O
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SMALL OUTLINE PACKAGE DIMENSIONS - CONTINUED THROUGH-HOLE
-A-
5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D G J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.210 0.220 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.405 0.415 0.540 0.560 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.33 5.59 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 10.29 10.54 13.72 14.22
-B-
8
G
1
0.25 (0.010)
M
TB
D 8 PL SA
S
S N
PIN 1 IDENTIFIER
DETAIL X
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C -T- K M J DETAIL X
SEATING PLANE
CASE 482B-03 ISSUE B
-A-
5 4
N -B-
8
G
1
0.25 (0.010)
M
TB
D 8 PL SA
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. S DIM A B C D G J K M N S V W SEATING PLANE INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.026 0.034 0.100 BSC 0.009 0.011 0.100 0.120 0_ 15 _ 0.444 0.448 0.540 0.560 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.66 0.864 2.54 BSC 0.23 0.28 2.54 3.05 0_ 15 _ 11.28 11.38 13.72 14.22 6.22 6.48 2.92 3.17
DETAIL X S W
V C
PIN 1 IDENTIFIER
-T- K M J DETAIL X
CASE 482C-03 ISSUE B
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MPXV4006G SERIES
NOTES
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MPXV4006G SERIES
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NOTES
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MPXV4006G SERIES
NOTES
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. MOTOROLA and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. E Motorola, Inc. 2002. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 Technical Information Center: 1-800-521-6274 HOME PAGE: http://www.motorola.com/semiconductors/
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